特性/ Features
Tg：≥170℃ （DSC）
低介电常数 (Dk≤3.7,1GHz) Low Dk (Dk≤3.7,1GHz)
低介质损耗 (Df≤0.006,1GHz) Low loss (Df≤0.006,1GHz)
低Z轴热膨胀系数 Low Z-CTE ≤3.0%
优良耐CAF性 Anti-CAF
优异耐热性T288=60min Excellent thermal resistance T288=60min
主要特性 / General properties
检测项目 Item | 单位 Unit | 检测条件 Test Condition | 规范值 Spec | 典型值 Typical Value | |
玻璃化转变温度Tg | ℃ | DSC | ≥170 | 175 | |
剥离强度 1oz Peel Strength | N/mm | 288℃, 10S | ≥0.7 | 1.03 | |
热应力 Thermal stress | S | 288℃,solder dip | ＞10 | 180 s No delamination | |
弯曲强度 Flexural Strength | N/mm2 | 经向 LW | ≥415 | 478 | |
纬向CW | ≥345 | 415 | |||
燃烧性Flammability | － | E 24/125 | UL94V-0 | V-0 | |
表面电阻Surface Resistivity | MΩ | After moisture | ≥1.0×104 | 3.54×108 | |
体积电阻Volume Resistivity | MΩ·cm | After moisture | ≥1.0×106 | 4.28×108 | |
介电常数 Dielectric Constant | － | C 24/23/50 | ≤5.2 | 3.7 | |
介质损耗角正切 Loss Tangent | － | C 24/23/50 | ≤0.035 | 0.006 | |
耐电弧Arc Resistance | S | D48/50＋D0.5/23 | ≥60 | 120 | |
击穿电压 Dielectric Breakdown | KV | D48/50＋D0.5/23 | ≥40 | 58 | |
吸水率Moisture Absorption | % | D24/23 | ≤0.35 | 0.08 | |
热分解温度Td | ℃ | Weight Loss 5% | ≥340 | 364 | |
CTE Z-axis | Alpha 1 | ppm / ℃ | TMA | ≤60 | 45 |
Alpha 2 | ppm / ℃ | ≤300 | 242 | ||
50 - 260 ℃ | % | ≤3.0 | 2.5 | ||
T288（不覆铜） | min | TMA | ≥15 | 60 | |
T300（不覆铜） | min | TMA | ≥2 | 5 | |
Specimen Thickness : 1.0mm ;
Specification sheet：IPC-4101C/126，is for your reference only
Explanation: C: Humidity conditioning;
D: Immersion conditioning in distilled water ;
E: Temperature conditioning ;